Copper Sulfate Solution, for Electroplating

CopperSulfateSolution,forelectroplating CopperSulfateSolution,forelectroplatingSpecifications (CuSO4·5H2O)295~305g/L (Cu)≥75g/L (Mn)≤5mg/L (Fe)≤4mg/L (Zn)≤ 4mg/L (Cl)≤4mg/L (Pb)≤3mg/L (Ca)≤2mg/L (Ni)≤2mg/L (As)≤2mg/L(Densityat25℃)1.17~1.19g/mL (pHvalue at25℃)1.50~2.50 Applications:Electronicdevices,ElectrolessCopperDeposition,PCB/FPCetc. Package:20L/BARREL;200L/BARREL Storageinstruction:Ifstoredproperlyabove18℃andinitsoriginalbarrel,ithasanindefiniteshelflife.

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Copper sulfate solution

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Wuzhou SaintGreen Technology Co,.Ltd

Copper Sulfate Solution, for electroplating

Copper Sulfate Solution, for electroplating	Specifications
(CuSO₄·5H₂O)	295~305 g/L
(Cu)	≥ 75 g/L
(Mn)	≤ 5 mg/L
(Fe)	≤ 4 mg/L
(Zn)	≤ 4 mg/L
(Cl)	≤ 4 mg/L
(Pb)	≤ 3 mg/L
(Ca)	≤ 2 mg/L
(Ni)	≤ 2 mg/L
(As)	≤ 2 mg/L
(Density at 25℃)	1.17~1.19 g/mL
(pH value at 25℃)	1.50~2.50

Applications:
Electronic devices, Electroless Copper Deposition, PCB/FPC etc.

Package:

20 L/BARREL;

200 L/BARREL

Storage instruction:

If stored properly above 18℃ and in its original barrel, it has an indefinite shelf life.

Wuzhou SaintGreen Technology Co,.Ltd

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